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UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Normalización mecánica de dispositivos semiconductores. Parte 6-19: Métodos de medida de deformación (warpage) de paquete a temperatura elevada y la deformación (warpage) máxima permisible (Ratificada por AENOR en septiembre de 2010.)
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| Standard number: | UNE EN 60191-6-19:2010 |
| Pages: | 17 |
| Released: | 2010-09-01 |
| Status: | Standard |
DESCRIPTION
This standard UNE EN 60191-6-19:2010 Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.) is classified in these ICS categories:
- 31.080.01