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>UNE standards>UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
in stockReleased: 2004-03-26
UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

UNE EN 60749-22:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 22: Robustez de las uniones soldadas.

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English PDF
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91.08 EUR
English Hardcopy
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Spanish PDF
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75.90 EUR
Spanish Hardcopy
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75.90 EUR
Standard number:UNE EN 60749-22:2004
Pages:48
Released:2004-03-26
Status:Standard
Pages (Spanish):22
DESCRIPTION

This standard UNE EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength is classified in these ICS categories:

  • 31.080.01
Categories:
UNE standards
31.080.01 Semiconductor devices in general
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