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>UNE standards>UNE EN 61191-3:2017 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
in stockReleased: 2017-10-01
UNE EN 61191-3:2017 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)

UNE EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)

Conjuntos de tarjetas con circuito impreso. Parte 3: Especificación intermedia. Conjuntos de montaje soldado a través de tablero. (Ratificada por la Asociación Española de Normalización en octubre de 2017.)

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Standard number:UNE EN 61191-3:2017
Pages:30
Released:2017-10-01
Status:Standard
DESCRIPTION

UNE EN 61191-3:2017

This part of IEC 61191 prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Categories:
UNE standards
31.180 Printed circuits and boards
31.240 Mechanical structures for electronic equipment
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