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>UNE standards>UNE EN 62047-13:2012 - Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)
in stockReleased: 2012-06-01
UNE EN 62047-13:2012 - Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)

UNE EN 62047-13:2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 13: Métodos de medición del ensayo tipo de resistencia adhesiva al curvado y cizallamiento para estructuras MEMS (Ratificada por AENOR en junio de 2012.)

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Standard number:UNE EN 62047-13:2012
Pages:18
Released:2012-06-01
Status:Standard
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UNE EN 62047-13:2012