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UNE EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 9: Medida de la resistencia de la unión oblea a oblea para NEMS. (Ratificada por AENOR en junio de 2012.)
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| Standard number: | UNE EN 62047-9:2011 |
| Pages: | 29 |
| Released: | 2012-06-01 |
DESCRIPTION
This standard UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.) is classified in these ICS categories:
- 31.080.99