UNE EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 2-808: Resistencia térmica de un montaje por método de transitorios térmicos (Ratificada por la Asociación Española de Normalización en julio de 2024.)
| Standard number: | UNE EN IEC 61189-2-808:2024 |
| Pages: | 29 |
| Released: | 2024-07-01 |
| Status: | Standard |
UNE EN IEC 61189-2-808:2024
This document describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. It is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. Note: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.