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in stockReleased: 2026-01-01
UNE EN IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Española de Normalización in January of 2026.)
Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 3-302: Detección de defectos de chapado en placas de circuito impreso despobladas mediante tomografía computerizada (TC). (Ratificada por la Asociación Española de Normalización en enero de 2026.)
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| Standard number: | UNE EN IEC 61189-3-302:2025 |
| Pages: | 26 |
| Released: | 2026-01-01 |
| Status: | Standard |
DESCRIPTION
This standard UNE EN IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Española de Normalización in January of 2026.) is classified in these ICS categories:
- 31.180