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>UNE standards>UNE EN IEC 61189-3-302:2025 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Española de Normalización in January of 2026.)
in stockReleased: 2026-01-01
UNE EN IEC 61189-3-302:2025 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Española de Normalización in January of 2026.)

UNE EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Española de Normalización in January of 2026.)

Métodos de ensayo para materiales eléctricos, tarjetas impresas y otras estructuras y montajes de interconexión. Parte 3-302: Detección de defectos de chapado en placas de circuito impreso despobladas mediante tomografía computerizada (TC). (Ratificada por la Asociación Española de Normalización en enero de 2026.)

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Standard number:UNE EN IEC 61189-3-302:2025
Pages:26
Released:2026-01-01
Status:Standard
DESCRIPTION

UNE EN IEC 61189-3-302:2025

This document describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT) . This document is applicable to non-destructive testing of metallized holes.