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>UNE standards>UNE EN IEC 61249-2-51:2023 - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
in stockReleased: 2023-07-01
UNE EN IEC 61249-2-51:2023 - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)

UNE EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)

Materiales para placas impresas y otras estructuras de interconexión. Parte 2-51: Materiales de base reforzados, con y sin revestimiento. Materiales de base para cinta portadora de tarjetas de circuitos integrados, sin revestimiento. (Ratificada por la Asociación Española de Normalización en julio de 2023.)

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Standard number:UNE EN IEC 61249-2-51:2023
Pages:25
Released:2023-07-01
Status:Standard
DESCRIPTION

UNE EN IEC 61249-2-51:2023

This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape, unclad(hereinafter referred to as IC carrier tape base materials). This standard is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.