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Homepage>UNE standards>UNE EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)
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in stockReleased: 2024-01-01
UNE EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)

UNE EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)

Método de ensayo para determinar las propiedades mecánicas de placas de circuito optoeléctricas flexibles sometidas a estrés térmico (Ratificada por la Asociación Española de Normalización en enero de 2024.)

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Standard number:UNE EN IEC 63251:2023
Pages:30
Released:2024-01-01
DESCRIPTION

This standard UNE EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.) is classified in these ICS categories:

  • 31.180