This part of the IEC 63287 provides guidelines for a reliability qualification plan for power semiconductor modules to assure reliability targets over the entire product life. Here, the term power semiconductor module refers to multichip semiconductor power modules as defined below in 3.3. Power semiconductor modules with incorporated control circuits are excluded. Clamped packages that need external pressure for being mounted in a system are excluded, e.g. disc-type pressure pack devices. This document is not intended for medical, military, aeronautics and astronautics-related applications.