Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
|Standards number:||ASTM F1893-18|
|Keywords:||burnout; failure; high dose-rate; integrated circuits; ionizing radiation; latchup; microcircuits; semiconductor devices; survivability;|
1.1 This guide defines the detailed requirements for testing semiconductor devices for short-pulse high dose-rate ionization-induced survivability and burnout failure. The test facility shall be capable of providing the necessary dose rates to perform the measurements. Typically, large flash X-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are utilized because of their high dose-rate capabilities. Electron Linear Accelerators (LINACs) may be used if the dose rate is sufficient. Two modes of test are described: (1) A survivability test, and (2) A burnout failure level test.
1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.
1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.