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Released: 01.06.2015
F3147-15
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
CURRENCY
| Standard number: | F3147-15 |
| Released: | 01.06.2015 |
| Status: | Active |
| Pages: | 3 |
| Section: | 10.04 |
| Keywords: | bend; conductive adhesive; encapsulant; land-pad; mandrel; printed flexible circuit; SMD; staking compound; |
DESCRIPTION
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).