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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS 3934-5:1997 Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
immediate downloadReleased: 1997-09-15
BS 3934-5:1997 Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

BS 3934-5:1997

Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

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Standard number:BS 3934-5:1997
Pages:38
Released:1997-09-15
ISBN:0 580 27812 3
Status:Standard
DESCRIPTION

BS 3934-5:1997


This standard BS 3934-5:1997 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).


Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
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