PRICES include / exclude VAT
Sponsored link
immediate downloadReleased: 2010-06-30
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Format
Availability
Price and currency
English Secure PDF
Immediate download
183.33 USD
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
18.33 USD
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standardfor 24 hours
55.00 USD
English Hardcopy
In stock
183.33 USD
| Standard number: | BS EN 60191-6-19:2010 |
| Pages: | 18 |
| Released: | 2010-06-30 |
| ISBN: | 978 0 580 60758 5 |
| Status: | Standard |
DESCRIPTION
BS EN 60191-6-19:2010
This standard BS EN 60191-6-19:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
- 31.080.01 Semiconductor devices in general
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).