Log inSign up
LANGUAGE en
Menu
STOREE-ReadingHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 USD
PRICES include / exclude VAT
Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Sponsored link
immediate downloadReleased: 2003-03-04
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

BS EN 60191-6-2:2002

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Format
Availability
Price and currency
English Secure PDF
Immediate download
163.80 USD
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
16.38 USD
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
49.14 USD
English Hardcopy
In stock
163.80 USD
Standard number:BS EN 60191-6-2:2002
Pages:14
Released:2003-03-04
ISBN:0 580 39260 0
Status:Corrigendum
DESCRIPTION

BS EN 60191-6-2:2002


This standard BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 01.100.25 Electrical and electronics engineering drawings
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Print