PRICES include / exclude VAT
Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Sponsored link
immediate downloadReleased: 2018-04-30
BS EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices

BS EN IEC 60191-1:2018

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices

Format
Availability
Price and currency
English Secure PDF
Immediate download
317.20 USD
English Hardcopy
In stock
317.20 USD
Standard number:BS EN IEC 60191-1:2018
Pages:44
Released:2018-04-30
ISBN:978 0 580 84425 6
Status:Standard
DESCRIPTION

BS EN IEC 60191-1:2018


This standard BS EN IEC 60191-1:2018 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.