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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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immediate downloadReleased: 2023-12-19
BS EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

BS EN IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

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Standard number:BS EN IEC 63251:2023
Pages:26
Released:2023-12-19
ISBN:978 0 539 05206 0
Status:Standard
DESCRIPTION

BS EN IEC 63251:2023


This standard BS EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.