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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
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immediate downloadReleased: 2023-08-30
BS IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300

BS IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300

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151.2 EUR
Standard number:BS IEC 61189-2-804:2023
Pages:12
Released:2023-08-30
ISBN:978 0 539 01307 8
Status:Standard
DESCRIPTION

BS IEC 61189-2-804:2023


This standard BS IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
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