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immediate downloadReleased: 2021-03-11
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
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| Standard number: | BS IEC 62899-202-7:2021 |
| Pages: | 16 |
| Released: | 2021-03-11 |
| ISBN: | 978 0 580 52003 7 |
| Status: | Standard |
DESCRIPTION
BS IEC 62899-202-7:2021
This standard BS IEC 62899-202-7:2021 Printed electronics is classified in these ICS categories:
- 29.035.01 Insulating materials in general
- 31.180 Printed circuits and boards
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.