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31.190 Electronic component assemblies

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Released: 2012-04-04
12/30262664 DC
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
LANGUAGE
English
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Released: 2017-09-01
17/30365805 DC
BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
LANGUAGE
English
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Released: 2019-06-21
19/30363054 DC
BS EN 60068-2-21. Environmental testing Part 2-21. Tests. Test U. Robustness of terminations and integral mounting devices
LANGUAGE
English
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Released: 2019-12-06
19/30407001 DC
BS EN 61386-23. Conduit systems for cable management Part 23. Particular requirements. Flexible conduit systems
LANGUAGE
English
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Released: 2019-12-13
20/30394767 DC
BS EN IEC 62878-2-601. Device Embedding assembly technology Part 2-602. Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
LANGUAGE
English
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Released: 2020-07-17
20/30420984 DC
BS EN IEC 61386-23/AA AMD AA. Conduit systems for cable management Part 23. Particular requirements. Flexible conduit systems
LANGUAGE
English
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Released: 2020-12-15
20/30424473 DC
BS EN 62435-9. Electronic components. Long-term storage of electronic semiconductor devices Part 9. Special Cases
LANGUAGE
English
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Released: 1998-03-15
BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality Index of test methods
LANGUAGE
English
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Released: 2012-04-30
BS EN 60068-2-21:2006
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
LANGUAGE
English
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Released: 2018-05-21
BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
LANGUAGE
English
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Released: 2019-09-11
BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
LANGUAGE
English
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Released: 2011-11-30
BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
LANGUAGE
English