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31.190 Electronic component assemblies

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Released: 2012-04-04
12/30262664 DC
BS EN 62588. Marking and Labeling of Components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
LANGUAGE
English
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Released: 2017-09-01
17/30365805 DC
BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
LANGUAGE
English
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Released: 2019-06-21
19/30363054 DC
BS EN 60068-2-21. Environmental testing Part 2-21. Tests. Test U. Robustness of terminations and integral mounting devices
LANGUAGE
English
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Released: 2020-07-29
20/30383597 DC
BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices Part 2. Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices
LANGUAGE
English
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Released: 2020-12-15
20/30424473 DC
BS EN 62435-9. Electronic components. Long-term storage of electronic semiconductor devices Part 9. Special Cases
LANGUAGE
English
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Released: 2021-01-06
21/30431274 DC
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design and use Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)
LANGUAGE
English
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Released: 1998-03-15
BS EN 160200-2:1998
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality Index of test methods
LANGUAGE
English
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Released: 2012-04-30
BS EN 60068-2-21:2006
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
LANGUAGE
English
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Released: 2018-05-21
BS EN 60068-2-58:2015+A1:2018
Environmental testing Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
LANGUAGE
English
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Released: 2019-09-11
BS EN 60068-2-69:2017+A1:2019
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
LANGUAGE
English
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Released: 2011-11-30
BS EN 60068-2-83:2011
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
LANGUAGE
English
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Released: 2006-09-29
BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
LANGUAGE
English