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31.190 Electronic component assemblies

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Released: 2009-03-31
BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
LANGUAGE
English
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Released: 2009-07-31
BS EN 62137-1-5:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
LANGUAGE
English
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Released: 2012-03-31
BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
LANGUAGE
English
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Released: 2015-06-30
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
LANGUAGE
English
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Released: 2010-06-30
BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
LANGUAGE
English
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Released: 2007-12-31
BS EN 62421:2007
Electronics assembly technology. Electronic modules
LANGUAGE
English
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Released: 2013-09-30
BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
LANGUAGE
English
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Released: 2016-10-31
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
LANGUAGE
English
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Released: 2017-04-30
BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
LANGUAGE
English
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Released: 2015-07-31
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
LANGUAGE
English
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Released: 2020-02-24
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
LANGUAGE
English
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Released: 2019-07-12
BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
LANGUAGE
English