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31.190 Electronic component assemblies
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573.18 USD
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573.18 USD
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
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511.06 USD
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511.06 USD
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310.59 USD
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310.59 USD
PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Released: 2022-08-23
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223.06 USD
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223.06 USD
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28.24 USD
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28.24 USD
BS EN IEC 62878-2-603:2025
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Released: 2025-04-16
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223.06 USD
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BS EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies
Product package labels for electronic components using bar code and two- dimensional symbologies
Released: 2017-07-31
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364.24 USD
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364.24 USD
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223.06 USD
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223.06 USD
BS EN 62129-2:2011
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Calibration of wavelength/optical frequency measurement instruments Michelson interferometer single wavelength meters
Released: 2011-07-31
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432.00 USD
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432.00 USD
BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions
Printed board design, manufacture and assembly. Terms and definitions
Released: 2006-09-29
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465.88 USD
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465.88 USD
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Released: 1997-12-15
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189.18 USD
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189.18 USD
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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409.41 USD
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409.41 USD