31.190 Electronic component assemblies
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
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Released: 2009-03-31
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
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Released: 2009-07-31
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
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Released: 2012-03-31
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
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Released: 2015-06-30
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
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Released: 2010-06-30
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
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Released: 2007-12-31
Electronics assembly technology. Electronic modules
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Released: 2013-09-30
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
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Released: 2016-10-31
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
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Released: 2017-04-30
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
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Released: 2015-07-31
Device embedded substrate Generic specification. Test methods
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Released: 2020-02-24
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
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Released: 2019-07-12
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies