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BS EN 62137-3:2012
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints
Released: 2012-03-31
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358.80 USD
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35.88 USD
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107.64 USD
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358.80 USD
BS EN 62137-4:2014
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
Released: 2015-06-30
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358.80 USD
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35.88 USD
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107.64 USD
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358.80 USD
BS EN 62417:2010
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Semiconductor devices. Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
Released: 2010-06-30
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163.80 USD
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16.38 USD
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49.14 USD
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163.80 USD
BS EN 62421:2007
Electronics assembly technology. Electronic modules
Electronics assembly technology. Electronic modules
Released: 2007-12-31
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195.00 USD
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19.50 USD
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58.50 USD
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195.00 USD
BS EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
Released: 2013-09-30
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195.00 USD
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19.50 USD
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58.50 USD
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195.00 USD
BS EN 62739-2:2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
Released: 2016-10-31
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195.00 USD
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19.50 USD
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58.50 USD
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195.00 USD
BS EN 62739-3:2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Released: 2017-04-30
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317.20 USD
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31.72 USD
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95.16 USD
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317.20 USD
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
Device embedded substrate Generic specification. Test methods
Released: 2015-07-31
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377.00 USD
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37.70 USD
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113.10 USD
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377.00 USD
BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Released: 2021-09-13
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358.80 USD
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35.88 USD
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107.64 USD
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358.80 USD
BS EN IEC 60068-2-82:2019 - TC
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Tracked Changes. Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2020-02-24
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413.40 USD
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413.40 USD
BS EN IEC 60068-2-82:2019
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Released: 2019-07-12
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317.20 USD
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31.72 USD
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95.16 USD
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317.20 USD
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Released: 2021-04-07
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317.20 USD
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31.72 USD
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95.16 USD
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317.20 USD