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>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-1 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Released: 01.08.2002
CSN EN 60191-6-1 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

CSN EN 60191-6-1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

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Number of Standard:CSN EN 60191-6-1
Category:358791
Pages:4
Released:01.08.2002
Catalog number:65179
DESCRIPTION

CSN EN 60191-6-1

CSN EN 60191-6-1 Tato část mezinárodní normy IEC 60191 obsahuje požadavky na konstrukční pravidla pro tvary vývodů plastikových pouzder s vývody ve tvaru křídla; např. QFP, SOP, SSOP, TSOP apod., což jsou pouzdra zatříděná jako tvar E v IEC 60191-4. Tato norma je určena k tomu, aby zavedla společná pravidla pro tvary vývodů bez ohledu na typ pouzdra.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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