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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-12 ed. 2 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
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CSN EN 60191-6-12 ed. 2 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

CSN EN 60191-6-12 ed. 2

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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English Hardcopy
In stock
64.71 USD
Category:358791
Released:2011
Number of Standard:CSN EN 60191-6-12 ed. 2
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EN 60191-6-12 ed. 2


EN 60191-6-12 ed. 2 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) - IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: 'Rectangular type' has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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