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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-18 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Released: 01.10.2010
CSN EN 60191-6-18 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

CSN EN 60191-6-18

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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Number of Standard:CSN EN 60191-6-18
Category:358791
Pages:32
Released:01.10.2010
Catalog number:86879
DESCRIPTION

CSN EN 60191-6-18

CSN EN 60191-6-18 Tato norma poskytuje společné výkresy a rozměry pro všechny typy pouzder s vývody v provedení jako pole kulových vývodů (BGA). Rozteč mezi vývody je jeden milimetr nebo více. Tvar pouzdra je čtvercový.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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