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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
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CSN EN 60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)

CSN EN 60191-6-20

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)

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English Hardcopy
In stock
64.71 USD
Category:358791
Released:2010
Number of Standard:CSN EN 60191-6-20
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EN 60191-6-20


EN 60191-6-20 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010) - IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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