ISO 14001:2026 - Environmental management systems — Requirements with guidance for use - Order now!

Log inSign up
LANGUAGE en
Menu
STOREMembershipHelp centerContactsDelivery chargesABOUT US News
SEARCH
0
Total price
0 USD
PRICES include / exclude VAT
>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-3 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Released: 01.08.2001
CSN EN 60191-6-3 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

CSN EN 60191-6-3

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Format
Availability
Price and currency
English Hardcopy
In stock
49.41 USD
FREE Shipping
Number of Standard:CSN EN 60191-6-3
Category:358791
Pages:4
Released:01.08.2001
Catalog number:62431
DESCRIPTION

CSN EN 60191-6-3

CSN EN 60191-6-3 Tato část evropské normy EN 60191 stanoví metodu, kterou se měří rozměry QFP, zatříděné do Tvaru E.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
Print