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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60749-16 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
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CSN EN 60749-16 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

CSN EN 60749-16

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

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English Hardcopy
In stock
48.42 USD
Category:358799
Released:2003
Number of Standard:CSN EN 60749-16
DESCRIPTION

EN 60749-16


EN 60749-16 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) - Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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