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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 62047-18 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
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CSN EN 62047-18 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

CSN EN 62047-18

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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English Hardcopy
In stock
57.65 USD
Category:358775
Released:2013
Number of Standard:CSN EN 62047-18
DESCRIPTION

EN 62047-18


EN 62047-18 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials - IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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