For multi-user versions of EN standards please contact us: info@en-standard.eu

 

PRICES include / exclude VAT
Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 62418 - Semiconductor devices - Metallization stress void test (IEC 62418:2010)
Sponsored link
FREE SHIPPINGReleased: 2010
CSN EN 62418 - Semiconductor devices - Metallization stress void test (IEC 62418:2010)

CSN EN 62418

Semiconductor devices - Metallization stress void test (IEC 62418:2010)

Format
Availability
Price and currency
English Hardcopy
In stock
80.00 USD
Category:358772
Released:2010
Number of Standard:CSN EN 62418
DESCRIPTION

EN 62418


EN 62418 Semiconductor devices - Metallization stress void test (IEC 62418:2010) - IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
Related products
English Hardcopy
In stock
45.88 USD
English Hardcopy
In stock
87.06 USD