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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN IEC 60749-20 ed. 3 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Released: 01.04.2021
CSN EN IEC 60749-20 ed. 3 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

CSN EN IEC 60749-20 ed. 3

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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Number of Standard:CSN EN IEC 60749-20 ed. 3
Category:358799
Pages:40
Released:01.04.2021
Catalog number:512277
DESCRIPTION

CSN EN IEC 60749-20 ed. 3

CSN EN IEC 60749-20 ed. 3 Tato norma poskytuje prostředky pro hodnocení odolnosti proti teplu při pájení uzavřených polovodičů, jako jsou v plastu zapouzdřené součástky pro povrchovou montáž (SMD). Tato zkouška je destruktivní.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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