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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-2-801 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
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Released: 01.02.2024
CSN EN IEC 61189-2-801 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

CSN EN IEC 61189-2-801

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

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Number of Standard:CSN EN IEC 61189-2-801
Category:359039
Pages:20
Released:01.02.2024
Catalog number:518367
DESCRIPTION

CSN EN IEC 61189-2-801

CSN EN IEC 61189-2-801 This part of IEC 61189 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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