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Homepage>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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180 results
First page123...579...131415Last page
UNE EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
Released: 2024-07-01
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74.80 EUR
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In stock
74.80 EUR
UNE EN 61249-2-11:2005 CORR:2005
Materials for printed boards and other interconnecting structures -- Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2005-10-26
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2.19 EUR
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2.19 EUR
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2.19 EUR
Spanish Hardcopy
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2.19 EUR
UNE EN 61249-2-12:2001
Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad.
Released: 2001-05-22
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91.08 EUR
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91.08 EUR
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75.90 EUR
Spanish Hardcopy
In stock
75.90 EUR
UNE EN 61249-3-5:2000
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS.
Released: 2000-11-21
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79.20 EUR
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In stock
79.20 EUR
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66.00 EUR
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66.00 EUR
UNE EN 61249-5-1:1997
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS).
Released: 1997-07-15
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91.08 EUR
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In stock
91.08 EUR
Spanish PDF
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75.90 EUR
Spanish Hardcopy
In stock
75.90 EUR
UNE EN 60249-1:1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.
Released: 1997-02-05
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129.36 EUR
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In stock
129.36 EUR
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107.80 EUR
Spanish Hardcopy
In stock
107.80 EUR
UNE EN 60249-2-1/A2:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
Released: 1996-10-14
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30.80 EUR
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30.80 EUR
UNE EN 60249-2-12/A4:2001
Base materials for printed circuits -- Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Released: 2001-12-31
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62.04 EUR
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In stock
62.04 EUR
Spanish PDF
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51.70 EUR
Spanish Hardcopy
In stock
51.70 EUR
UNE EN 60249-2-14/A5:2001
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality
Released: 2001-12-31
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62.04 EUR
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62.04 EUR
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51.70 EUR
Spanish Hardcopy
In stock
51.70 EUR
UNE EN 60249-2-16/A3:2001
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
Released: 2001-12-31
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46.20 EUR
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In stock
46.20 EUR
Spanish PDF
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38.50 EUR
Spanish Hardcopy
In stock
38.50 EUR
UNE EN 60249-2-17:1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
Released: 1997-08-11
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77.88 EUR
English Hardcopy
In stock
77.88 EUR
Spanish PDF
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64.90 EUR
Spanish Hardcopy
In stock
64.90 EUR
UNE EN 60249-2-19/A1:1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Released: 1997-10-17
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34.32 EUR
English Hardcopy
In stock
34.32 EUR
Spanish PDF
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28.60 EUR
Spanish Hardcopy
In stock
28.60 EUR
180 results
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