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Main page>ICS codes>31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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45 results
First page124
UNE EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
Released: 2013-10-01
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73.70 EUR
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In stock
73.70 EUR
UNE EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
Released: 2003-07-01
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73.70 EUR
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73.70 EUR
UNE EN 61190-1-1:2002
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
Released: 2002-11-01
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75.90 EUR
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75.90 EUR
UNE EN 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
Released: 2017-11-01
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94.60 EUR
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94.60 EUR
UNE EN 61193-1:2002
Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.)
Released: 2002-07-01
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75.90 EUR
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75.90 EUR
UNE EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
Released: 2020-01-01
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82.50 EUR
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82.50 EUR
UNE EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
Released: 2021-05-01
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93.50 EUR
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93.50 EUR
UNE EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)
Released: 2025-03-01
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90.20 EUR
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90.20 EUR
UNE EN IEC 60068-2-83:2025
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (Endorsed by Asociación Española de Normalización in September of 2025.)
Released: 2025-09-01
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99.00 EUR
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99.00 EUR
45 results
First page124