ISO 14001:2026 - Environmental management systems — Requirements with guidance for use - Order now!

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>ICS codes>31 ELECTRONICS>31.190 Electronic component assemblies

31.190 Electronic component assemblies

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46 results
First page124
UNE EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
Released: 2003-07-01
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86.71 USD
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86.71 USD
UNE EN 61190-1-1:2002
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
Released: 2002-11-01
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89.29 USD
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89.29 USD
UNE EN 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
Released: 2017-11-01
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111.29 USD
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111.29 USD
UNE EN 61193-1:2002
Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.)
Released: 2002-07-01
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89.29 USD
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89.29 USD
UNE EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
Released: 2007-12-01
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84.12 USD
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84.12 USD
UNE EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
Released: 2009-05-01
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91.88 USD
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91.88 USD
UNE EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
Released: 2009-05-01
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76.35 USD
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76.35 USD
UNE EN 62421:2007
Electronics assembly technology - Electronic modules (IEC 62421:2007). (Endorsed by AENOR in March of 2008.)
Released: 2008-03-01
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82.82 USD
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82.82 USD
UNE EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
Released: 2013-10-01
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86.71 USD
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86.71 USD
UNE EN IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
Released: 2020-01-01
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97.06 USD
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97.06 USD
46 results
First page124