IEEE 1101.7-1995

This standard establishes the design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments. The requirements herein serve to specify the mechanical design of the module.

The purpose of this standard is the specification of dimensions and tolerances that will ensure the mechanical intermatability of space and highly ruggedized modules within associated subracks. Modules aspect ratios and materials/processes of current standards do not cover needs. This lack has resulted in emergence of a defacto mechanical standard for space modules, currently being produced by multiple companies. The working group will define parameters to better accommodate high dynamic mechanical stresses, limited thermal dissipation, and use of space qualifiable materials and processes. The defacto space applications standard defined by the Advanced Spaceborne Computer Module will be encompassed.

New IEEE Standard - Inactive-Withdrawn. Withdrawn Standard. Withdrawn Date: Jan 15, 2001. The design requirements for a module designated for use in spacecraft, boosters, and other highly rugged, conductively cooled environments are established in this standard. The requirements herein serve to specify the mechanical design of the module. Dimensions and tolerances for racks, modules, printed wiring boards, backplanes, and other connector-related dimensions that are specific to the use of 300-pin and 396-pin connectors are given. These dimensions and tolerances are designed to ensure mechanical function and interoperability.