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Current revisionReleased: 01.03.2018
IPC-J-STD-033 - Revision D
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
111.00 USD
Chinese Hardcopy
10-14 days
166.51 USD
English Secure PDF
Immediate download
Non-printable
111.00 USD
English Hardcopy
10-14 days
166.51 USD
Japanese Secure PDF
Immediate download
Non-printable
155.00 USD
Japanese Hardcopy
10-14 days
232.51 USD
Spanish Secure PDF
Immediate download
Non-printable
111.00 USD
Spanish Hardcopy
10-14 days
166.51 USD
View table of Contents
IPC-J-STD-075 - Standard Only
IPC-J-STD-075 - Revision A
IPC-J-STD-075 - Revision B
| Standard Number: | IPC-J-STD-033 - Revision D |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | D |
| Released: | 01.03.2018 |
| ISBN (English): | 978-1-61193-348-2 |
| Pages (English): | 32 |
| ISBN (Chinese): | 978-1-61193-397-0 |
| Pages (Chinese): | 32 |
| ISBN (Japanese): | 978-1-63816-029-8 |
| Pages (Japanese): | 32 |
| ISBN (Spanish): | 978-1-61193-451-9 |
| Pages (Spanish): | 36 |
DESCRIPTION
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
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