IPC-J-STD-075 - Standard Only
Classification of Non-IC Electronic Components for Assembly Processes
| Standard Number: | IPC-J-STD-075 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 03.09.2008 |
| Pages (English): | 20 |
| Pages (Chinese): | 12 |
| Pages (German): | 12 |
| ISBN (Spanish): | 978-1-61193-368-0 |
| Pages (Spanish): | 16 |
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. It outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC. 20 pages. Released August 2008.