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Homepage>UNE standards>UNE EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
in stockReleased: 2004-06-11
UNE EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)

UNE EN 60749-14:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 14: Robustez de los terminales (integridad de los conectores).

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Standard number:UNE EN 60749-14:2004
Pages:35
Released:2004-06-11
DESCRIPTION

This standard UNE EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity) is classified in these ICS categories:

  • 31.080.01