PRICES include / exclude VAT
in stockReleased: 2025-05-01
UNE EN IEC 62878-2-603:2025
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)
Sustrato empotrado en dispositivo. Parte 2-603: Directrices para módulo electrónico apilado. Método de ensayo de la conectividad eléctrica intermodular (Ratificada por la Asociación Española de Normalización en mayo de 2025.)
Format
Availability
Price and currency
English PDF
Immediate download
Printable
82.82 USD
English Hardcopy
In stock
82.82 USD
| Standard number: | UNE EN IEC 62878-2-603:2025 |
| Pages: | 22 |
| Released: | 2025-05-01 |
| Status: | Standard |
DESCRIPTION
UNE EN IEC 62878-2-603:2025
This document specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as Known Good Module.