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in stockReleased: 2025-08-01
UNE EN IEC 63378-3:2025
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis (Endorsed by Asociación Española de Normalización in August of 2025.)
Normalización térmica en paquetes de semiconductores. Parte 3: Modelos de simulación de circuitos térmicos de paquetes de semiconductores discretos para análisis transitorios (Ratificada por la Asociación Española de Normalización en agosto de 2025.)
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| Standard number: | UNE EN IEC 63378-3:2025 |
| Pages: | 22 |
| Released: | 2025-08-01 |
| Status: | Standard |
DESCRIPTION
UNE EN IEC 63378-3:2025
This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.