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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>23/30454374 DC BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures
immediate downloadReleased: 2023-04-20
23/30454374 DC BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

23/30454374 DC

BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices Part 47. Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

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Standard number:23/30454374 DC
Pages:16
Released:2023-04-20
Status:Draft for Comment
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23/30454374 DC


This standard 23/30454374 DC BS EN IEC 62047-47. Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices