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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

immediate downloadReleased: 2022-05-06

BS EN IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

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Standard number:	BS EN IEC 61189-2-501:2022
Pages:	24
Released:	2022-05-06
ISBN:	978 0 539 12503 0
Status:	Standard

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BS EN IEC 61189-2-501:2022

This standard BS EN IEC 61189-2-501:2022 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

31.180 Printed circuits and boards

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

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