31.180 Printed circuits and boards
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Price include VAT will be charged for customers of European Union – non VAT payers.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
immediate download
Released: 1997-12-15
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
immediate download
Released: 1998-12-15
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
immediate download
Released: 2003-04-01
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
immediate download
Released: 2003-10-16
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
immediate download
Released: 2007-12-31
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
immediate download
Released: 2007-12-31
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
immediate download
Released: 2007-12-31
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
immediate download
Released: 2008-05-30
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
immediate download
Released: 2017-09-28
Printed boards and printed board assemblies. Design and use Electronic component zero orientation for CAD library construction
immediate download
Released: 2013-07-31
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
immediate download
Released: 2002-06-21
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
immediate download
Released: 2016-10-31
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)