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31.180 Printed circuits and boards

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Released: 1997-12-15
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
LANGUAGE
English
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Released: 1998-12-15
BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance
LANGUAGE
English
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Released: 2003-04-01
BS EN 61188-5-1:2002
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
LANGUAGE
English
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Released: 2003-10-16
BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
LANGUAGE
English
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Released: 2007-12-31
BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
LANGUAGE
English
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Released: 2007-12-31
BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
LANGUAGE
English
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Released: 2007-12-31
BS EN 61188-5-5:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
LANGUAGE
English
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Released: 2008-05-30
BS EN 61188-5-8:2008
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
LANGUAGE
English
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Released: 2017-09-28
BS EN 61188-7:2017
Printed boards and printed board assemblies. Design and use Electronic component zero orientation for CAD library construction
LANGUAGE
English
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Released: 2013-07-31
BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
LANGUAGE
English
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Released: 2002-06-21
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
LANGUAGE
English
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Released: 2016-10-31
BS EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
LANGUAGE
English