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>ICS codes>31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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182 results
First page123...81012...141516Last page
UNE EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures -- Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (Endorsed by AENOR in January of 2006.)
Released: 2006-01-01
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64.90 EUR
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In stock
64.90 EUR
UNE EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
Released: 2021-11-01
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66.00 EUR
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In stock
66.00 EUR
UNE EN IEC 62878-2-603:2025
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)
Released: 2025-05-01
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69.30 EUR
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69.30 EUR
UNE EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)
Released: 2024-01-01
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75.90 EUR
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75.90 EUR
UNE EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
Released: 2023-07-01
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71.50 EUR
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71.50 EUR
UNE EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
Released: 2023-10-01
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62.70 EUR
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In stock
62.70 EUR
UNE EN IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)
Released: 2023-10-01
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64.90 EUR
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In stock
64.90 EUR
UNE EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
Released: 2022-04-01
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71.50 EUR
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In stock
71.50 EUR
UNE EN IEC 61249-2-52:2025
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by Asociación Española de Normalización in December of 2025.)
Released: 2025-12-01
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75.90 EUR
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In stock
75.90 EUR
UNE EN 60249-1/A4:1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.
Released: 1997-02-05
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28.60 EUR
Spanish Hardcopy
In stock
28.60 EUR
UNE EN 60249-2-10/A5:2001
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test).
Released: 2001-10-30
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62.04 EUR
English Hardcopy
In stock
62.04 EUR
Spanish PDF
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Printable
51.70 EUR
Spanish Hardcopy
In stock
51.70 EUR
UNE EN 60249-2-10:1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILIY (VERTICAL BURNING TEST).
Released: 1996-07-24
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66.00 EUR
Spanish Hardcopy
In stock
66.00 EUR
182 results
First page123...81012...141516Last page