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download between 0-24 hoursReleased: 2023-08-16
IEC 62899-202-10:2023
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
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| Standard number: | IEC 62899-202-10:2023 |
| Released: | 2023-08-16 |
| Language: | English |
DESCRIPTION
IEC 62899-202-10:2023
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation. This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.