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Homepage>IEC Standards>IEC 62899-202-9:2023 - Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
download between 0-24 hoursReleased: 2023-08-03
IEC 62899-202-9:2023 - Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

IEC 62899-202-9:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

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Standard number:IEC 62899-202-9:2023
Released:2023-08-03
Language:English
DESCRIPTION

IEC 62899-202-9:2023

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

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