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IPC-HERMES-9852 - Version 1.6 - Standard Only
The Global Standard for Machine-to-Machine Communication in SMT Assembly
The Global Standard for Machine-to-Machine Communication in SMT Assembly
Released: 01.07.2024
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158.10 EUR
English Hardcopy
10-14 days
237.15 EUR
Chinese Secure PDF
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29.75 EUR
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10-14 days
44.63 EUR
English Secure PDF
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29.75 EUR
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10-14 days
44.63 EUR
French Secure PDF
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42.50 EUR
French Hardcopy
10-14 days
63.75 EUR
German Secure PDF
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42.50 EUR
German Hardcopy
10-14 days
63.75 EUR
Spanish Secure PDF
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29.75 EUR
Spanish Hardcopy
10-14 days
44.63 EUR
Chinese Secure PDF
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Non-printable
158.10 EUR
Chinese Hardcopy
10-14 days
237.15 EUR
English Secure PDF
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158.10 EUR
English Hardcopy
10-14 days
237.15 EUR
French Secure PDF
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223.55 EUR
French Hardcopy
10-14 days
335.33 EUR
German Secure PDF
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223.55 EUR
German Hardcopy
10-14 days
335.33 EUR
Japanese Secure PDF
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223.55 EUR
Japanese Hardcopy
10-14 days
335.33 EUR
Spanish Secure PDF
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158.10 EUR
Spanish Hardcopy
10-14 days
237.15 EUR
IPC-J-STD-001 - Revision J - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Released: 01.03.2024
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300.05 EUR
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450.08 EUR
IPC-J-STD-003 - Revision B
Solderability Tests for Printed Boards
Solderability Tests for Printed Boards
Released: 01.03.2007
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168.30 EUR
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252.45 EUR
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168.30 EUR
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10-14 days
252.45 EUR
IPC-J-STD-003 - Revision C - With Amendment 1-2
Solderability Tests for Printed Boards
Solderability Tests for Printed Boards
Released: 01.09.2017
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168.30 EUR
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252.45 EUR
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168.30 EUR
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252.45 EUR
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235.45 EUR
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353.18 EUR
IPC-J-STD-004 - Revision D
Requirements for Soldering Fluxes
Requirements for Soldering Fluxes
Released: 01.12.2023
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168.30 EUR
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252.45 EUR
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168.30 EUR
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10-14 days
252.45 EUR
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238.85 EUR
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10-14 days
358.28 EUR
IPC-J-STD-005 - Revision A
Requirements for Soldering Pastes
Requirements for Soldering Pastes
Released: 14.02.2012
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94.35 EUR
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141.53 EUR
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94.35 EUR
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10-14 days
141.53 EUR
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130.05 EUR
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10-14 days
195.08 EUR
IPC-J-STD-012 - Standard Only
Implementation of Flip Chip & Chip Scale Technology
Implementation of Flip Chip & Chip Scale Technology
Released: 01.01.1996
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168.30 EUR
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252.45 EUR
IPC-J-STD-013 - Standard Only
Implementation of Ball Grid Array & Other High Density Technology
Implementation of Ball Grid Array & Other High Density Technology
Released: 01.07.1996
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131.75 EUR
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197.63 EUR
IPC-J-STD-033 - Revision D
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Released: 01.03.2018
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94.35 EUR
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141.53 EUR
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94.35 EUR
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10-14 days
141.53 EUR
Japanese Secure PDF
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131.75 EUR
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10-14 days
197.63 EUR
Spanish Secure PDF
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94.35 EUR
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10-14 days
141.53 EUR
IPC-J-STD-075 - Standard Only
Classification of Non-IC Electronic Components for Assembly Processes
Classification of Non-IC Electronic Components for Assembly Processes
Released: 03.09.2008
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94.35 EUR
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10-14 days
141.53 EUR
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94.35 EUR
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10-14 days
141.53 EUR
German Secure PDF
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Non-printable
131.75 EUR
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10-14 days
197.63 EUR
Spanish Secure PDF
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Non-printable
94.35 EUR
Spanish Hardcopy
10-14 days
141.53 EUR