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IPC-HERMES-9852 - Version 1.5 - Standard Only
The Global Standard for Machine-to-Machine Communication in SMT Assembly
The Global Standard for Machine-to-Machine Communication in SMT Assembly
Released: 01.11.2022
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IPC-HERMES-9852 - Version 1.6 - Standard Only
The Global Standard for Machine-to-Machine Communication in SMT Assembly
The Global Standard for Machine-to-Machine Communication in SMT Assembly
Released: 01.07.2024
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35.00 USD
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52.51 USD
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35.00 USD
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35.00 USD
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186.00 USD
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263.00 USD
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394.51 USD
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186.00 USD
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279.00 USD
IPC-J-STD-001 - Revision J - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Released: 01.03.2024
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IPC-J-STD-003 - Revision B
Solderability Tests for Printed Boards
Solderability Tests for Printed Boards
Released: 01.03.2007
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IPC-J-STD-003 - Revision C - With Amendment 1-2
Solderability Tests for Printed Boards
Solderability Tests for Printed Boards
Released: 01.09.2017
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277.00 USD
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IPC-J-STD-004 - Revision D
Requirements for Soldering Fluxes
Requirements for Soldering Fluxes
Released: 01.12.2023
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IPC-J-STD-005 - Revision A
Requirements for Soldering Pastes
Requirements for Soldering Pastes
Released: 14.02.2012
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IPC-J-STD-012 - Standard Only
Implementation of Flip Chip & Chip Scale Technology
Implementation of Flip Chip & Chip Scale Technology
Released: 01.01.1996
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IPC-J-STD-013 - Standard Only
Implementation of Ball Grid Array & Other High Density Technology
Implementation of Ball Grid Array & Other High Density Technology
Released: 01.07.1996
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IPC-J-STD-033 - Revision D
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Released: 01.03.2018
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232.51 USD
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111.00 USD
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166.51 USD