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Homepage>UNE standards>UNE EN 60191-6-3:2000 Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
in stockReleased: 2001-12-01
UNE EN 60191-6-3:2000 Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)

UNE EN 60191-6-3:2000

Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)

Normalización mecánica de dispositivos semiconductores. Parte 6-3: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Métodos de medida para las dimensiones de los paquetes de cajas planas cuadrangulares (QFP) (Ratificada por AENOR en diciembre de 2001)

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Standard number:UNE EN 60191-6-3:2000
Pages:21
Released:2001-12-01
DESCRIPTION

This standard UNE EN 60191-6-3:2000 Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.) is classified in these ICS categories:

  • 31.080.01